Richard Ciocci

Affiliate Researcher
Titles and Affiliations
Associate Professor, School of Science, Engineering & Technology (Harrisburg)

Research Summary

Research interests lie primarily in the areas of design and advanced manufacturing with focus on improvement and efficiency. I have had the opportunity to investigate the application of design for the environment and green manufacturing to lead-free soldering technologies in electronics production.

In the News

Research Keywords

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Recent Publications

Regulations and market trends in lead-free and halogen-free electronics

Nie, L., Pecht, M. & Ciocci, R., May 22 2007, In: Circuit World. 33, 2, p. 4-9 6 p.

Research output: Contribution to journalArticlepeer-review

Impact of environmental regulations on green electronics manufacture

Ciocci, R. & Pecht, M., 2006, In: Microelectronics International. 23, 2, p. 45-50 6 p.

Research output: Contribution to journalReview articlepeer-review

Learning from the migration to lead-free solder

Ciocci, R. & Pecht, M., Jul 31 2006, In: Soldering and Surface Mount Technology. 18, 3, p. 14-18 5 p.

Research output: Contribution to journalArticlepeer-review

Teaching sustainable engineering ten years later: What's worked & what's next?

Ciocci, R., 2006, In: ASEE Annual Conference and Exposition, Conference Proceedings.

Research output: Contribution to journalConference articlepeer-review

Previews of coming attractions - Employing the first year seminar to prepare engineering freshmen for success in college and beyond

Cottrell, D., Ciocci, R. C. & Shoup, J., Jan 1 2006, In: ASEE Annual Conference and Exposition, Conference Proceedings.

Research output: Contribution to journalConference articlepeer-review

American Society of Mechanical Engineers, Technology and Society Division (Publication) TS: Introduction

Marquez, T., Ciocci, R. C., Gardner, T., Jablokow, K. W., Kennedy, R., Kreith, F., Lausten, C., Lesikar, J., Sessions, J., Talreja, R. & Westbrook, D., Jan 1 2006, In: American Society of Mechanical Engineers, Technology and Society Division (Publication) TS.

Research output: Contribution to journalEditorialpeer-review

Questions concerning the migration to lead-free solder

Ciocci, R. & Pecht, M., Feb 16 2004, In: Circuit World. 30, 2, p. 34-40+6+8

Research output: Contribution to journalReview articlepeer-review

Engineering and engineering technology program assessments - DACUM style

Ciocci, R., Dec 1 2003, In: ASEE Annual Conference Proceedings. p. 6527-6533 7 p.

Research output: Contribution to journalConference articlepeer-review

Assessment of an engineering and technology summer program for underrepresented students

Ciocci, R. C., Dec 1 2001, In: ASEE Annual Conference Proceedings. p. 2263-2269 7 p.

Research output: Contribution to journalConference articlepeer-review

Handling the migration to lead free

Ciocci, R. C., Sep 2001, In: IEEE Transactions on Components and Packaging Technologies. 24, 3, p. 536-538 3 p.

Research output: Contribution to journalArticlepeer-review

Lead-free solder replacement: Beyond the material substitution

Ciocci, R., Dec 1 2001, In: Proceedings of SPIE - The International Society for Optical Engineering. 4569, p. 100-108 9 p.

Research output: Contribution to journalConference articlepeer-review

Applied algebra with laboratory experimentation

Ciocci, R. C., Godbois, C. & Leung, E., 1998, In: ASEE Annual Conference Proceedings.

Research output: Contribution to journalArticlepeer-review

Product reuse and reliability

Ciocci, R. C., 1996, In: ASEE Annual Conference Proceedings. p. 2623-2628 6 p.

Research output: Contribution to journalArticlepeer-review