Madhavan Swaminathan

Affiliate Researcher
Titles and Affiliations
Professor, Electrical Engineering

In the News

Research Keywords

Recent Publications

Characterization of Emerging Polymer Dielectric Materials for Advanced Packaging Applications

Dwarakanath, S., Bhaskar, P., Kanno, K., Nimbalkar, P. C., Kathaperumal, M., Raj Pulugurtha, M., Swaminathan, M. & Tummala, R. R., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 1, p. 131-139 9 p.

Research output: Contribution to journalArticlepeer-review

Ultra-Miniaturized, High-Performance Filters on Alumina Ribbon Ceramic Substrates for 5G Small-Cell Applications

Aslani-Amoli, N., Liu, F., Swaminathan, M., Zhuang, C. G., Zhelev, N. Z., Seok, S. H. & Kim, C., Mar 1 2024, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 14, 3, p. 437-444 8 p.

Research output: Contribution to journalArticlepeer-review

Efficient monostatic anisotropic point scatterer model for high performance computing

Huang, E. & Swaminathan, M., 2024, In: Journal of Electromagnetic Waves and Applications. 38, 4, p. 522-537 16 p.

Research output: Contribution to journalArticlepeer-review

A PPA Study for Heterogeneous 3-D IC Options: Monolithic, Hybrid Bonding, and Microbumping

Kim, J., Zhu, L., Torun, H. M., Swaminathan, M. & Lim, S. K., Mar 1 2024, In: IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 32, 3, p. 401-412 12 p.

Research output: Contribution to journalArticlepeer-review

Glass Package With Multiple Embedded Dies for mmWave Applications

Li, X., Jia, X., Woo Kim, J., Erdogan, S., Moon, K. S., Jordan, M. B. & Swaminathan, M., 2024, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 14, 10, p. 1816-1824 9 p.

Research output: Contribution to journalArticlepeer-review

Correction to: A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates (Polymers, (2023), 15, 19, (3895), 10.3390/polym15193895)

Nimbalkar, P., Bhaskar, P., Kathaperumal, M., Swaminathan, M. & Tummala, R. R., Oct 2024, In: Polymers. 16, 19, 2751.

Research output: Contribution to journalComment/debatepeer-review

Air-Filled SIWs Using Laminate Dielectrics on Glass Substrate for D-Band Applications

Rehman, M. U., Kumar, L. N. V., Erdogan, S. & Swaminathan, M., Jan 1 2024, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 14, 1, p. 98-105 8 p.

Research output: Contribution to journalArticlepeer-review

Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits

Vanna-Iampikul, P., Woo, S., Erdogan, S., Zhu, L., Kathaperumal, M., Agarwal, R., Gupta, R., Rinebold, K., Swaminathan, M. & Lim, S. K., 2024, (Accepted/In press) In: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

Research output: Contribution to journalArticlepeer-review

Surrogate Modeling With Complex-Valued Neural Nets for Signal Integrity Applications

Akinwande, O., Erdogan, S., Kumar, R. & Swaminathan, M., 2023, (Accepted/In press) In: IEEE Transactions on Microwave Theory and Techniques. p. 1-12 12 p.

Research output: Contribution to journalArticlepeer-review

Ultralow-Loss Substrate-Integrated Waveguides in Alumina Ribbon Ceramic Substrates for 75-170 GHz Wireless Applications

Aslani-Amoli, N., Rehman, M. U., Vijay Kumar, L. N., Moradinia, A., Liu, F., Swaminathan, M., Zhuang, C. G., Vaddi, R., Seok, S. H. & Kim, C., Oct 1 2023, In: IEEE Microwave and Wireless Technology Letters. 33, 10, p. 1415-1418 4 p.

Research output: Contribution to journalArticlepeer-review

Effect of Vapor Phase Infiltration on Metal-Polymer Adhesion for Ultra-Low-k Dielectric Materials

Bhaskar, P., Shackelford, E., McGuinness, E. K., Kathaperumal, M., Losego, M. D. & Swaminathan, M., Dec 1 2023, In: IEEE Transactions on Device and Materials Reliability. 23, 4, p. 564-570 7 p.

Research output: Contribution to journalArticlepeer-review

D-Band Integrated and Miniaturized Quasi-Yagi Antenna Array in Glass Interposer

Erdogan, S., Moon, K. S. J., Kathaperumal, M. & Swaminathan, M., May 1 2023, In: IEEE Transactions on Terahertz Science and Technology. 13, 3, p. 270-279 10 p.

Research output: Contribution to journalArticlepeer-review

Extrapolation With Range Determination of 2-D Spectral Transposed Convolutional Neural Network for Advanced Packaging Problems

Guo, Y., Jia, X., Li, X., Wang, Y., Kumar, R., Sharma, R. & Swaminathan, M., Oct 1 2023, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 13, 10, p. 1533-1544 12 p.

Research output: Contribution to journalArticlepeer-review

Antenna Array on Glass Interposer for 6G Wireless Communications

Huang, K. Q. & Swaminathan, M., Feb 1 2023, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 13, 2, p. 211-218 8 p.

Research output: Contribution to journalArticlepeer-review

Antenna With Embedded Die in Glass Interposer for 6G Wireless Applications

Jia, X., Li, X., Erdogan, S., Moon, K. S., Kim, J. W., Huang, K. Q., Jordan, M. B. & Swaminathan, M., Feb 1 2023, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 13, 2, p. 219-229 11 p.

Research output: Contribution to journalArticlepeer-review