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Recent Publications
Ultra-Miniaturized, High-Performance Filters on Alumina Ribbon Ceramic Substrates for 5G Small-Cell Applications
Aslani-Amoli, N., Liu, F., Swaminathan, M., Zhuang, C. G., Zhelev, N. Z., Seok, S. H. & Kim, C., Mar 1 2024, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 14, 3, p. 437-444 8 p.Research output: Contribution to journal › Article › peer-review
Characterization of emerging polymer dielectric materials for advanced packaging applications
Dwarakanath, S., Bhaskar, P., Kanno, K., Nimbalkar, P. C., Kathaperumal, M., Pulugurtha, M. R., Swaminathan, M. & Tummala, R. R., 2024, (Accepted/In press) In: IEEE Transactions on Components, Packaging and Manufacturing Technology.Research output: Contribution to journal › Article › peer-review
Efficient monostatic anisotropic point scatterer model for high performance computing
Huang, E. & Swaminathan, M., 2024, In: Journal of Electromagnetic Waves and Applications. 38, 4, p. 522-537 16 p.Research output: Contribution to journal › Article › peer-review
A PPA Study for Heterogeneous 3-D IC Options: Monolithic, Hybrid Bonding, and Microbumping
Kim, J., Zhu, L., Torun, H. M., Swaminathan, M. & Lim, S. K., Mar 1 2024, In: IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 32, 3, p. 401-412 12 p.Research output: Contribution to journal › Article › peer-review
Glass Package With Multiple Embedded Dies for mmWave Applications
Li, X., Jia, X., Woo Kim, J., Erdogan, S., Moon, K. S., Jordan, M. B. & Swaminathan, M., 2024, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 14, 10, p. 1816-1824 9 p.Research output: Contribution to journal › Article › peer-review
Correction to: A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates (Polymers, (2023), 15, 19, (3895), 10.3390/polym15193895)
Nimbalkar, P., Bhaskar, P., Kathaperumal, M., Swaminathan, M. & Tummala, R. R., Oct 2024, In: Polymers. 16, 19, 2751.Research output: Contribution to journal › Comment/debate › peer-review
Air-Filled SIWs Using Laminate Dielectrics on Glass Substrate for D-Band Applications
Rehman, M. U., Kumar, L. N. V., Erdogan, S. & Swaminathan, M., Jan 1 2024, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 14, 1, p. 98-105 8 p.Research output: Contribution to journal › Article › peer-review
Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits
Vanna-Iampikul, P., Woo, S., Erdogan, S., Zhu, L., Kathaperumal, M., Agarwal, R., Gupta, R., Rinebold, K., Swaminathan, M. & Lim, S. K., 2024, (Accepted/In press) In: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.Research output: Contribution to journal › Article › peer-review
Surrogate Modeling With Complex-Valued Neural Nets for Signal Integrity Applications
Akinwande, O., Erdogan, S., Kumar, R. & Swaminathan, M., 2023, (Accepted/In press) In: IEEE Transactions on Microwave Theory and Techniques. p. 1-12 12 p.Research output: Contribution to journal › Article › peer-review
Ultralow-Loss Substrate-Integrated Waveguides in Alumina Ribbon Ceramic Substrates for 75-170 GHz Wireless Applications
Aslani-Amoli, N., Rehman, M. U., Vijay Kumar, L. N., Moradinia, A., Liu, F., Swaminathan, M., Zhuang, C. G., Vaddi, R., Seok, S. H. & Kim, C., Oct 1 2023, In: IEEE Microwave and Wireless Technology Letters. 33, 10, p. 1415-1418 4 p.Research output: Contribution to journal › Article › peer-review
Effect of Vapor Phase Infiltration on Metal-Polymer Adhesion for Ultra-Low-k Dielectric Materials
Bhaskar, P., Shackelford, E., McGuinness, E. K., Kathaperumal, M., Losego, M. D. & Swaminathan, M., Dec 1 2023, In: IEEE Transactions on Device and Materials Reliability. 23, 4, p. 564-570 7 p.Research output: Contribution to journal › Article › peer-review
D-Band Integrated and Miniaturized Quasi-Yagi Antenna Array in Glass Interposer
Erdogan, S., Moon, K. S. J., Kathaperumal, M. & Swaminathan, M., May 1 2023, In: IEEE Transactions on Terahertz Science and Technology. 13, 3, p. 270-279 10 p.Research output: Contribution to journal › Article › peer-review
Extrapolation With Range Determination of 2-D Spectral Transposed Convolutional Neural Network for Advanced Packaging Problems
Guo, Y., Jia, X., Li, X., Wang, Y., Kumar, R., Sharma, R. & Swaminathan, M., Oct 1 2023, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 13, 10, p. 1533-1544 12 p.Research output: Contribution to journal › Article › peer-review
Antenna Array on Glass Interposer for 6G Wireless Communications
Huang, K. Q. & Swaminathan, M., Feb 1 2023, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 13, 2, p. 211-218 8 p.Research output: Contribution to journal › Article › peer-review
Antenna With Embedded Die in Glass Interposer for 6G Wireless Applications
Jia, X., Li, X., Erdogan, S., Moon, K. S., Kim, J. W., Huang, K. Q., Jordan, M. B. & Swaminathan, M., Feb 1 2023, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 13, 2, p. 219-229 11 p.Research output: Contribution to journal › Article › peer-review