In the News
Research Keywords
These keywords and phrases come from the publications and other research output of this person. See other researchers related to these topics by clicking on any keyword.
Recent Publications
Transfer Learning Framework for 3-D Electromagnetic Applications
Akinwande, O., Jia, X., Deroo, A., Lu, Y., Lin, H., Tseng, B. C. & Swaminathan, M., 2025, In: IEEE Transactions on Microwave Theory and Techniques. 73, 8, p. 4490-4500 11 p.Research output: Contribution to journal › Article › peer-review
Package Integration and System Performance Analysis of Glass-Based Passive Components for 5G New Radio Millimeter-Wave Modules
Ali, M., Watanabe, A., Kakutani, T., Raj, P. M., Tummala, R. R. & Swaminathan, M., Apr 2025, In: Electronics (Switzerland). 14, 8, 1670.Research output: Contribution to journal › Article › peer-review
Design and Demonstration of Dual-Core Spiral Package-Embedded Inductors for Integrated Voltage Regulators
Avula, V., Murali, P. & Swaminathan, M., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 6, p. 1275-1283 9 p.Research output: Contribution to journal › Article › peer-review
Substrate-Embedded Microfluidic Cooling of Distributed Vertical Power Delivery Architectures for High-Performance Computing Processors
Choi, M., Krishnakumar, S., Rahimzadeh Khorasani, R., Swaminathan, M., Partin-Vaisband, I. & Kumar, S., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 9, p. 1912-1920 9 p.Research output: Contribution to journal › Article › peer-review
Characterization of Emerging Polymer Dielectric Materials for Advanced Packaging Applications
Dwarakanath, S., Bhaskar, P., Kanno, K., Nimbalkar, P. C., Kathaperumal, M., Raj Pulugurtha, M., Swaminathan, M. & Tummala, R. R., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 1, p. 131-139 9 p.Research output: Contribution to journal › Article › peer-review
Broadband Characterization of Interconnects in Die-Embedded Glass Interposer
Erdogan, S., Jia, X., Li, X., Kathaperumal, M., Agarwal, R. & Swaminathan, M., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 4, p. 766-773 8 p.Research output: Contribution to journal › Article › peer-review
Deep Kernel-Based Hyperparameter Adaptive Learning and Frequency Response Predictions Using Transposed Convolutional Neural Network
Guo, Y., Wang, Y., Corsello, J. & Swaminathan, M., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 9, p. 1964-1972 9 p.Research output: Contribution to journal › Article › peer-review
Antenna-Integrated and PA-Embedded Glass Substrates for D-Band InP Power Amplifier Modules
Jia, X., Li, X., Woo Kim, J., Moon, K. S., Rodwell, M. J. W. & Swaminathan, M., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 4, p. 782-791 10 p.Research output: Contribution to journal › Article › peer-review
Advances in Package Microvia Interconnects: Breakthroughs with Picosecond UV Laser Ablation
Liu, F., Zhang, R., Kimiyuki, K., Kim, J. W., Swaminathan, M. & Tummala, R. R., 2025, (Accepted/In press) In: IEEE Transactions on Components, Packaging and Manufacturing Technology.Research output: Contribution to journal › Article › peer-review
Effect of Metal Filler Modification on Toroidal Inductors for Package Embedded Integrated Voltage Regulators
Murali, P., Bhaskar, P., Buchanan, C. C., Gilbert, D. A., Swaminathan, M. & Losego, M. D., Oct 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 10, p. 2170-2177 8 p.Research output: Contribution to journal › Article › peer-review
Glass Packaging for 6G Applications
Swaminathan, M., Li, X., Vijay Kumar, L. N., Jia, X., Erdogan, S., Rehman, M. U., Huang, K. Q., Kim, J. W., Al-Juwhari, M. & Ahamed, M., 2025, In: IEEE Microwave Magazine. 26, 6, p. 46-64 19 p.Research output: Contribution to journal › Article › peer-review
Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits
Vanna-Iampikul, P., Woo, S., Erdogan, S., Zhu, L., Kathaperumal, M., Agarwal, R., Gupta, R., Rinebold, K., Swaminathan, M. & Kyu Lim, S., 2025, In: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 44, 5, p. 1954-1967 14 p.Research output: Contribution to journal › Article › peer-review
GPU Accelerated Matrix Solution Using Novel Preconditioner for Three Dimensional Laguerre-FDTD Method
Wang, Y., Guo, Y., Corsello, J. & Swaminathan, M., 2025, In: IEEE Journal on Multiscale and Multiphysics Computational Techniques. 10, p. 259-270 12 p.Research output: Contribution to journal › Article › peer-review
Surrogate Modeling With Complex-Valued Neural Nets for Signal Integrity Applications
Akinwande, O., Erdogan, S., Kumar, R. & Swaminathan, M., Jan 1 2024, In: IEEE Transactions on Microwave Theory and Techniques. 72, 1, p. 478-489 12 p.Research output: Contribution to journal › Article › peer-review
Ultra-Miniaturized, High-Performance Filters on Alumina Ribbon Ceramic Substrates for 5G Small-Cell Applications
Aslani-Amoli, N., Liu, F., Swaminathan, M., Zhuang, C. G., Zhelev, N. Z., Seok, S. H. & Kim, C., Mar 1 2024, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 14, 3, p. 437-444 8 p.Research output: Contribution to journal › Article › peer-review