Madhavan Swaminathan
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Recent Publications
Self-Consistent Electrothermal Modeling of Distributed Vertical Power Delivery Architecture With Substrate-Embedded Microfluidic Cooling
Choi, M., Krishnakumar, S., Popryho, Y., Khorasani, R. R., Swaminathan, M., Partin-Vaisband, I. & Kumar, S., Jul 1 2026, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 16, 7, p. 1534-1542 9 p.Research output: Contribution to journal › Article › peer-review
A Comprehensive Design Framework for Vertical Power Delivery in High-Performance Computing
Krishnakumar, S., Popryho, Y., Choi, M., Rahimzadeh Khorasani, R., Swaminathan, M., Kumar, S. & Partin-Vaisband, I., Sep 2026, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 16, 9, p. 2089-2102 14 p.Research output: Contribution to journal › Article › peer-review
D-Band Substrate Integrated Waveguide-Fed Endfire Antenna Array in Ultrathin Glass Interposer
Kumar, L. N. V., Li, X., Smet, V., Moon, K. S. & Swaminathan, M., Apr 1 2026, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 16, 4, p. 837-847 11 p.Research output: Contribution to journal › Article › peer-review
Embedded High-Power RF Chips in Glass Core Package
Li, X., Jia, X., Moon, K. S., Warren, S., Ketterson, A. & Swaminathan, M., Apr 1 2026, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 16, 4, p. 693-702 10 p.Research output: Contribution to journal › Article › peer-review
SCOPE: A Machine Learning Framework for System-Level Forward Prediction, Inverse Design, and Uncertainty Quantification in Co-Packaged Optics
Sheikh Sofla, S. & Swaminathan, M., Jun 1 2026, In: Journal of Lightwave Technology. 44, 11, p. 4600-4615 16 p.Research output: Contribution to journal › Article › peer-review
Integrated Vertical Power Delivery – Review & Challenges
Swaminathan, M., Khorasani, R. R., Partin-Vaisband, I., Sharma, R. & Kumar, S., 2026, (Accepted/In press) In: IEEE Transactions on Components, Packaging and Manufacturing Technology.Research output: Contribution to journal › Review article › peer-review
Vision-Based Transformer Model for Fast Simulation of Advanced Packaging Structure
Wang, Y., Li, X., Guo, Y. & Swaminathan, M., 2026, In: IEEE Journal on Multiscale and Multiphysics Computational Techniques. 11, p. 291-300 10 p.Research output: Contribution to journal › Article › peer-review
Integrated Circuit-on-Glass (ICoG): A Self-Packaged 3D-Heterogeneous Integration (3DHI) Platform for Millimeter-Wave Circuits With Embedded GaN-on-Si Dielets
Yadav, P., Li, X., Palacios, T. & Swaminathan, M., 2026, In: IEEE Transactions on Microwave Theory and Techniques. 74, 1, p. 63-72 10 p.Research output: Contribution to journal › Article › peer-review
Transfer Learning Framework for 3-D Electromagnetic Applications
Akinwande, O., Jia, X., Deroo, A., Lu, Y., Lin, H., Tseng, B. C. & Swaminathan, M., 2025, In: IEEE Transactions on Microwave Theory and Techniques. 73, 8, p. 4490-4500 11 p.Research output: Contribution to journal › Article › peer-review
Package Integration and System Performance Analysis of Glass-Based Passive Components for 5G New Radio Millimeter-Wave Modules
Ali, M., Watanabe, A., Kakutani, T., Raj, P. M., Tummala, R. R. & Swaminathan, M., Apr 2025, In: Electronics. 14, 8, 1670.Research output: Contribution to journal › Article › peer-review
Design and Demonstration of Dual-Core Spiral Package-Embedded Inductors for Integrated Voltage Regulators
Avula, V., Murali, P. & Swaminathan, M., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 6, p. 1275-1283 9 p.Research output: Contribution to journal › Article › peer-review
Substrate-Embedded Microfluidic Cooling of Distributed Vertical Power Delivery Architectures for High-Performance Computing Processors
Choi, M., Krishnakumar, S., Rahimzadeh Khorasani, R., Swaminathan, M., Partin-Vaisband, I. & Kumar, S., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 9, p. 1912-1920 9 p.Research output: Contribution to journal › Article › peer-review
Characterization of Emerging Polymer Dielectric Materials for Advanced Packaging Applications
Dwarakanath, S., Bhaskar, P., Kanno, K., Nimbalkar, P. C., Kathaperumal, M., Raj Pulugurtha, M., Swaminathan, M. & Tummala, R. R., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 1, p. 131-139 9 p.Research output: Contribution to journal › Article › peer-review
Broadband Characterization of Interconnects in Die-Embedded Glass Interposer
Erdogan, S., Jia, X., Li, X., Kathaperumal, M., Agarwal, R. & Swaminathan, M., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 4, p. 766-773 8 p.Research output: Contribution to journal › Article › peer-review
Deep Kernel-Based Hyperparameter Adaptive Learning and Frequency Response Predictions Using Transposed Convolutional Neural Network
Guo, Y., Wang, Y., Corsello, J. & Swaminathan, M., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 9, p. 1964-1972 9 p.Research output: Contribution to journal › Article › peer-review
