Madhavan Swaminathan
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Recent Publications
Integrated Circuit-on-Glass (ICoG): A Self-Packaged 3D-Heterogeneous Integration (3DHI) Platform for Millimeter-Wave Circuits With Embedded GaN-on-Si Dielets
Yadav, P., Li, X., Palacios, T. & Swaminathan, M., 2026, In: IEEE Transactions on Microwave Theory and Techniques. 74, 1, p. 63-72 10 p.Research output: Contribution to journal › Article › peer-review
Transfer Learning Framework for 3-D Electromagnetic Applications
Akinwande, O., Jia, X., Deroo, A., Lu, Y., Lin, H., Tseng, B. C. & Swaminathan, M., 2025, In: IEEE Transactions on Microwave Theory and Techniques. 73, 8, p. 4490-4500 11 p.Research output: Contribution to journal › Article › peer-review
Package Integration and System Performance Analysis of Glass-Based Passive Components for 5G New Radio Millimeter-Wave Modules
Ali, M., Watanabe, A., Kakutani, T., Raj, P. M., Tummala, R. R. & Swaminathan, M., Apr 2025, In: Electronics (Switzerland). 14, 8, 1670.Research output: Contribution to journal › Article › peer-review
Design and Demonstration of Dual-Core Spiral Package-Embedded Inductors for Integrated Voltage Regulators
Avula, V., Murali, P. & Swaminathan, M., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 6, p. 1275-1283 9 p.Research output: Contribution to journal › Article › peer-review
Self-Consistent Electrothermal Modeling of Distributed Vertical Power Delivery Architecture With Substrate-Embedded Microfluidic Cooling
Choi, M., Krishnakumar, S., Popryho, Y., Khorasani, R. R., Swaminathan, M., Partin-Vaisband, I. & Kumar, S., 2025, (Accepted/In press) In: IEEE Transactions on Components, Packaging and Manufacturing Technology.Research output: Contribution to journal › Article › peer-review
Substrate-Embedded Microfluidic Cooling of Distributed Vertical Power Delivery Architectures for High-Performance Computing Processors
Choi, M., Krishnakumar, S., Rahimzadeh Khorasani, R., Swaminathan, M., Partin-Vaisband, I. & Kumar, S., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 9, p. 1912-1920 9 p.Research output: Contribution to journal › Article › peer-review
Characterization of Emerging Polymer Dielectric Materials for Advanced Packaging Applications
Dwarakanath, S., Bhaskar, P., Kanno, K., Nimbalkar, P. C., Kathaperumal, M., Raj Pulugurtha, M., Swaminathan, M. & Tummala, R. R., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 1, p. 131-139 9 p.Research output: Contribution to journal › Article › peer-review
Broadband Characterization of Interconnects in Die-Embedded Glass Interposer
Erdogan, S., Jia, X., Li, X., Kathaperumal, M., Agarwal, R. & Swaminathan, M., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 4, p. 766-773 8 p.Research output: Contribution to journal › Article › peer-review
Deep Kernel-Based Hyperparameter Adaptive Learning and Frequency Response Predictions Using Transposed Convolutional Neural Network
Guo, Y., Wang, Y., Corsello, J. & Swaminathan, M., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 9, p. 1964-1972 9 p.Research output: Contribution to journal › Article › peer-review
Antenna-Integrated and PA-Embedded Glass Substrates for D-Band InP Power Amplifier Modules
Jia, X., Li, X., Woo Kim, J., Moon, K. S., Rodwell, M. J. W. & Swaminathan, M., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 4, p. 782-791 10 p.Research output: Contribution to journal › Article › peer-review
Advances in Package Microvia Interconnects: Breakthroughs with Picosecond UV Laser Ablation
Liu, F., Zhang, R., Kimiyuki, K., Kim, J. W., Swaminathan, M. & Tummala, R. R., 2025, (Accepted/In press) In: IEEE Transactions on Components, Packaging and Manufacturing Technology.Research output: Contribution to journal › Article › peer-review
Effect of Metal Filler Modification on Toroidal Inductors for Package Embedded Integrated Voltage Regulators
Murali, P., Bhaskar, P., Buchanan, C. C., Gilbert, D. A., Swaminathan, M. & Losego, M. D., Oct 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 10, p. 2170-2177 8 p.Research output: Contribution to journal › Article › peer-review
Glass Packaging for 6G Applications
Swaminathan, M., Li, X., Vijay Kumar, L. N., Jia, X., Erdogan, S., Rehman, M. U., Huang, K. Q., Kim, J. W., Al-Juwhari, M. & Ahamed, M., 2025, In: IEEE Microwave Magazine. 26, 6, p. 46-64 19 p.Research output: Contribution to journal › Article › peer-review
Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits
Vanna-Iampikul, P., Woo, S., Erdogan, S., Zhu, L., Kathaperumal, M., Agarwal, R., Gupta, R., Rinebold, K., Swaminathan, M. & Kyu Lim, S., 2025, In: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 44, 5, p. 1954-1967 14 p.Research output: Contribution to journal › Article › peer-review
GPU Accelerated Matrix Solution Using Novel Preconditioner for Three Dimensional Laguerre-FDTD Method
Wang, Y., Guo, Y., Corsello, J. & Swaminathan, M., 2025, In: IEEE Journal on Multiscale and Multiphysics Computational Techniques. 10, p. 259-270 12 p.Research output: Contribution to journal › Article › peer-review