
In the News
Research Keywords
These keywords and phrases come from the publications and other research output of this person. See other researchers related to these topics by clicking on any keyword.
Recent Publications
Transfer Learning Framework for 3-D Electromagnetic Applications
Akinwande, O., Jia, X., Deroo, A., Lu, Y., Lin, H., Tseng, B. C. & Swaminathan, M., 2025, (Accepted/In press) In: IEEE Transactions on Microwave Theory and Techniques.Research output: Contribution to journal › Article › peer-review
Design and demonstration of dual-core spiral package-embedded inductors for Integrated Voltage Regulators
Avula, V., Murali, P. & Swaminathan, M., 2025, (Accepted/In press) In: IEEE Transactions on Components, Packaging and Manufacturing Technology.Research output: Contribution to journal › Article › peer-review
Substrate-Embedded Microfluidic Cooling of Distributed Vertical Power Delivery Architectures for High-Performance Computing Processors
Choi, M., Krishnakumar, S., Khorasani, R. R., Swaminathan, M., Partin-Vaisband, I. & Kumar, S., 2025, (Accepted/In press) In: IEEE Transactions on Components, Packaging and Manufacturing Technology.Research output: Contribution to journal › Article › peer-review
Characterization of Emerging Polymer Dielectric Materials for Advanced Packaging Applications
Dwarakanath, S., Bhaskar, P., Kanno, K., Nimbalkar, P. C., Kathaperumal, M., Raj Pulugurtha, M., Swaminathan, M. & Tummala, R. R., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 1, p. 131-139 9 p.Research output: Contribution to journal › Article › peer-review
Broadband Characterization of Interconnects in Die-Embedded Glass Interposer
Erdogan, S., Jia, X., Li, X., Kathaperumal, M., Agarwal, R. & Swaminathan, M., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 4, p. 766-773 8 p.Research output: Contribution to journal › Article › peer-review
Antenna-Integrated and PA-Embedded Glass Substrates for D-Band InP Power Amplifier Modules
Jia, X., Li, X., Woo Kim, J., Moon, K. S., Rodwell, M. J. W. & Swaminathan, M., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 4, p. 782-791 10 p.Research output: Contribution to journal › Article › peer-review
Surrogate Modeling With Complex-Valued Neural Nets for Signal Integrity Applications
Akinwande, O., Erdogan, S., Kumar, R. & Swaminathan, M., Jan 1 2024, In: IEEE Transactions on Microwave Theory and Techniques. 72, 1, p. 478-489 12 p.Research output: Contribution to journal › Article › peer-review
Ultra-Miniaturized, High-Performance Filters on Alumina Ribbon Ceramic Substrates for 5G Small-Cell Applications
Aslani-Amoli, N., Liu, F., Swaminathan, M., Zhuang, C. G., Zhelev, N. Z., Seok, S. H. & Kim, C., Mar 1 2024, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 14, 3, p. 437-444 8 p.Research output: Contribution to journal › Article › peer-review
Efficient monostatic anisotropic point scatterer model for high performance computing
Huang, E. & Swaminathan, M., 2024, In: Journal of Electromagnetic Waves and Applications. 38, 4, p. 522-537 16 p.Research output: Contribution to journal › Article › peer-review
A PPA Study for Heterogeneous 3-D IC Options: Monolithic, Hybrid Bonding, and Microbumping
Kim, J., Zhu, L., Torun, H. M., Swaminathan, M. & Lim, S. K., Mar 1 2024, In: IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 32, 3, p. 401-412 12 p.Research output: Contribution to journal › Article › peer-review
Glass Package With Multiple Embedded Dies for mmWave Applications
Li, X., Jia, X., Woo Kim, J., Erdogan, S., Moon, K. S., Jordan, M. B. & Swaminathan, M., 2024, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 14, 10, p. 1816-1824 9 p.Research output: Contribution to journal › Article › peer-review
Correction to: A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates (Polymers, (2023), 15, 19, (3895), 10.3390/polym15193895)
Nimbalkar, P., Bhaskar, P., Kathaperumal, M., Swaminathan, M. & Tummala, R. R., Oct 2024, In: Polymers. 16, 19, 2751.Research output: Contribution to journal › Comment/debate › peer-review
Air-Filled SIWs Using Laminate Dielectrics on Glass Substrate for D-Band Applications
Rehman, M. U., Kumar, L. N. V., Erdogan, S. & Swaminathan, M., Jan 1 2024, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 14, 1, p. 98-105 8 p.Research output: Contribution to journal › Article › peer-review
Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits
Vanna-Iampikul, P., Woo, S., Erdogan, S., Zhu, L., Kathaperumal, M., Agarwal, R., Gupta, R., Rinebold, K., Swaminathan, M. & Lim, S. K., 2024, (Accepted/In press) In: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.Research output: Contribution to journal › Article › peer-review
Ultralow-Loss Substrate-Integrated Waveguides in Alumina Ribbon Ceramic Substrates for 75-170 GHz Wireless Applications
Aslani-Amoli, N., Rehman, M. U., Vijay Kumar, L. N., Moradinia, A., Liu, F., Swaminathan, M., Zhuang, C. G., Vaddi, R., Seok, S. H. & Kim, C., Oct 1 2023, In: IEEE Microwave and Wireless Technology Letters. 33, 10, p. 1415-1418 4 p.Research output: Contribution to journal › Article › peer-review