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Recent Publications
Ultra-Miniaturized, High-Performance Filters on Alumina Ribbon Ceramic Substrates for 5G Small-Cell Applications
Aslani-Amoli, N., Liu, F., Swaminathan, M., Zhuang, C. G., Zhelev, N. Z., Seok, S. H. & Kim, C., 2024, (Accepted/In press) In: IEEE Transactions on Components, Packaging and Manufacturing Technology. p. 1 1 p.Research output: Contribution to journal › Article › peer-review
A PPA Study for Heterogeneous 3-D IC Options: Monolithic, Hybrid Bonding, and Microbumping
Kim, J., Zhu, L., Torun, H. M., Swaminathan, M. & Lim, S. K., Mar 1 2024, In: IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 32, 3, p. 401-412 12 p.Research output: Contribution to journal › Article › peer-review
Air-Filled SIWs Using Laminate Dielectrics on Glass Substrate for D-Band Applications
Rehman, M. U., Kumar, L. N. V., Erdogan, S. & Swaminathan, M., Jan 1 2024, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 14, 1, p. 98-105 8 p.Research output: Contribution to journal › Article › peer-review
Surrogate Modeling With Complex-Valued Neural Nets for Signal Integrity Applications
Akinwande, O., Erdogan, S., Kumar, R. & Swaminathan, M., 2023, (Accepted/In press) In: IEEE Transactions on Microwave Theory and Techniques. p. 1-12 12 p.Research output: Contribution to journal › Article › peer-review
Ultralow-Loss Substrate-Integrated Waveguides in Alumina Ribbon Ceramic Substrates for 75-170 GHz Wireless Applications
Aslani-Amoli, N., Rehman, M. U., Vijay Kumar, L. N., Moradinia, A., Liu, F., Swaminathan, M., Zhuang, C. G., Vaddi, R., Seok, S. H. & Kim, C., Oct 1 2023, In: IEEE Microwave and Wireless Technology Letters. 33, 10, p. 1415-1418 4 p.Research output: Contribution to journal › Article › peer-review
Effect of Vapor Phase Infiltration on Metal-Polymer Adhesion for Ultra-Low-k Dielectric Materials
Bhaskar, P., Shackelford, E., McGuinness, E. K., Kathaperumal, M., Losego, M. D. & Swaminathan, M., Dec 1 2023, In: IEEE Transactions on Device and Materials Reliability. 23, 4, p. 564-570 7 p.Research output: Contribution to journal › Article › peer-review
D-Band Integrated and Miniaturized Quasi-Yagi Antenna Array in Glass Interposer
Erdogan, S., Moon, K. S. J., Kathaperumal, M. & Swaminathan, M., May 1 2023, In: IEEE Transactions on Terahertz Science and Technology. 13, 3, p. 270-279 10 p.Research output: Contribution to journal › Article › peer-review
Extrapolation With Range Determination of 2-D Spectral Transposed Convolutional Neural Network for Advanced Packaging Problems
Guo, Y., Jia, X., Li, X., Wang, Y., Kumar, R., Sharma, R. & Swaminathan, M., Oct 1 2023, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 13, 10, p. 1533-1544 12 p.Research output: Contribution to journal › Article › peer-review
Antenna Array on Glass Interposer for 6G Wireless Communications
Huang, K. Q. & Swaminathan, M., Feb 1 2023, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 13, 2, p. 211-218 8 p.Research output: Contribution to journal › Article › peer-review
Antenna With Embedded Die in Glass Interposer for 6G Wireless Applications
Jia, X., Li, X., Erdogan, S., Moon, K. S., Kim, J. W., Huang, K. Q., Jordan, M. B. & Swaminathan, M., Feb 1 2023, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 13, 2, p. 219-229 11 p.Research output: Contribution to journal › Article › peer-review
A Critical Review of Lithography Methodologies and Impacts of Topography on 2.5-D/3-D Interposers
Liu, F., Nimbalkar, P., Aslani-Amoli, N., Kathaperumal, M., Tummala, R. & Swaminathan, M., Mar 1 2023, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 13, 3, p. 291-299 9 p.Research output: Contribution to journal › Article › peer-review
A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates
Nimbalkar, P., Bhaskar, P., Kathaperumal, M., Swaminathan, M. & Tummala, R. R., Oct 2023, In: Polymers. 15, 19, 3895.Research output: Contribution to journal › Review article › peer-review
Characterization of Microstrip Line and SIW on ABF in Glass Interposers for mmWave Applications
Ur Rehman, M., Kumar, L. N. V. & Swaminathan, M., Sep 1 2023, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 13, 9, p. 1520-1523 4 p.Research output: Contribution to journal › Article › peer-review
Terahertz Characterization of Glass-Based Materials and Stackups for 6 G Microelectronics Packaging
Zhai, M., Bhaskar, P., Shi, H., Swaminathan, M., Locquet, A. & Citrin, D. S., Dec 2023, In: Journal of Infrared, Millimeter, and Terahertz Waves. 44, 11-12, p. 841-857 17 p.Research output: Contribution to journal › Article › peer-review
Characterization of Alumina Ribbon Ceramic Substrates for 5G and mm-Wave Applications
Aslani-Amoli, N., Ur Rehman, M., Liu, F., Swaminathan, M., Zhuang, C. G., Zhelev, N. Z., Seok, S. H. & Kim, C., Sep 1 2022, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 12, 9, p. 1432-1445 14 p.Research output: Contribution to journal › Article › peer-review