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Recent Publications
Frequency dependence of wake-up and fatigue characteristics in ferroelectric Al0.93B0.07N thin films
He, F., Zhu, W., Hayden, J., Casamento, J., Tran, Q., Kang, K., Song, Y., Akkopru-Akgun, B., Yang, J. I., Tipsawat, P., Brennecka, G., Choi, S., Jackson, T. N., Maria, J. P. & Trolier-McKinstry, S., Mar 1 2024, In: Acta Materialia. 266, 119678.Research output: Contribution to journal › Article › peer-review
Thermal Characterization of Ferroelectric Al1-xBxN for Nonvolatile Memory
Kang, K., Casamento, J. A., Shoemaker, D. C., Song, Y., Ozdemir, E. Z., McIlwaine, N. S., Maria, J. P., Choi, S. & Trolier-McKinstry, S. E., Dec 11 2024, In: ACS Applied Materials and Interfaces. 16, 49, p. 67921-67933 13 p.Research output: Contribution to journal › Article › peer-review
A Comparative Analysis of Electrical and Optical Thermometry Techniques for AlGaN/GaN HEMTs
Kim, S., Shoemaker, D. C., Karim, A., Walwil, H., Dejarld, M. T., Tahhan, M. B., Vaillancourt, J., Chumbes, E. M., Laroche, J. R., Pavlidis, G., Graham, S. & Choi, S., 2024, (Accepted/In press) In: IEEE Transactions on Electron Devices.Research output: Contribution to journal › Article › peer-review
Substrate dependence of the self-heating in lead zirconate titanate (PZT) MEMS actuators
Song, Y., Kang, K., Tipsawat, P., Cheng, C. Y., Zhu, W., LaBella, M., Choi, S. & Trolier-McKinstry, S. E., Apr 28 2024, In: Journal of Applied Physics. 135, 16Research output: Contribution to journal › Article › peer-review
WELCOME TO ASME 2023 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS (INTERPACK2023)
Choi, S., Lall, P., Karajgikar, S., Agonafer, D., Won, Y., Shah, J. & Prakash, A., 2023, In: Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023. v001t00a001.Research output: Contribution to journal › Editorial › peer-review
Thermal analysis of an α-Ga2O3 MOSFET using micro-Raman spectroscopy
Karim, A., Song, Y., Shoemaker, D. C., Jeon, D. W., Park, J. H., Mun, J. K., Lee, H. K. & Choi, S., Nov 6 2023, In: Applied Physics Letters. 123, 19, 192104.Research output: Contribution to journal › Article › peer-review
Transient Thermal Management of a β-GaO MOSFET Using a Double-Side Diamond Cooling Approach
Kim, S. H., Shoemaker, D., Green, A. J., Chabak, K. D., Liddy, K. J., Graham, S. & Choi, S., Apr 1 2023, In: IEEE Transactions on Electron Devices. 70, 4, p. 1628-1635 8 p.Research output: Contribution to journal › Article › peer-review
Implications of Interfacial Thermal Transport on the Self-Heating of GaN-on-SiC High Electron Mobility Transistors
Shoemaker, D. C., Song, Y., Kang, K., Schuette, M. L., Tweedie, J. S., Sheppard, S. T., McIlwaine, N. S., Maria, J. P. & Choi, S., Oct 1 2023, In: IEEE Transactions on Electron Devices. 70, 10, p. 5036-5043 8 p.Research output: Contribution to journal › Article › peer-review
Ultra-Wide Band Gap Ga2O3-on-SiC MOSFETs
Song, Y., Bhattacharyya, A., Karim, A., Shoemaker, D., Huang, H. L., Roy, S., McGray, C., Leach, J. H., Hwang, J., Krishnamoorthy, S. & Choi, S., Feb 8 2023, In: ACS Applied Materials and Interfaces. 15, 5, p. 7137-7147 11 p.Research output: Contribution to journal › Article › peer-review
Special Issue on InterPACK2022
Yang, J., Choi, S., Leever, B. & Chen, C., Dec 1 2023, In: Journal of Electronic Packaging. 145, 4, 4063893.Research output: Contribution to journal › Editorial › peer-review
β-Gallium oxide power electronics
Green, A. J., Speck, J., Xing, G., Moens, P., Allerstam, F., Gumaelius, K., Neyer, T., Arias-Purdue, A., Mehrotra, V., Kuramata, A., Sasaki, K., Watanabe, S., Koshi, K., Blevins, J., Bierwagen, O., Krishnamoorthy, S., Leedy, K., Arehart, A. R., Neal, A. T. & Mou, S. & 14 others, , Feb 1 2022, In: APL Materials. 10, 2, 029201.Research output: Contribution to journal › Article › peer-review
ASME 2022 INTERNATIONAL TECHNICAL CONFERENCE and EXHIBITION on PACKAGING and INTEGRATION of ELECTRONIC and PHOTONIC MICROSYSTEMS
Gromala, P., Prakash, A., Choi, S., Agonafer, D., Won, Y. & Karajgikar, S., 2022, In: Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2022. v001t00a001.Research output: Contribution to journal › Editorial › peer-review
Thermally-Aware Layout Design of β-GaO Lateral MOSFETs
Kim, S. H., Shoemaker, D., Chatterjee, B., Green, A. J., Chabak, K. D., Heller, E. R., Liddy, K. J., Jessen, G. H., Graham, S. & Choi, S., Mar 1 2022, In: IEEE Transactions on Electron Devices. 69, 3, p. 1251-1257 7 p.Research output: Contribution to journal › Article › peer-review
All-around diamond for cooling power devices
Ryou, J. H. & Choi, S., Dec 2022, In: Nature Electronics. 5, 12, p. 834-835 2 p.Research output: Contribution to journal › Article › peer-review
Growth-microstructure-thermal property relations in AlN thin films
Song, Y., Zhang, C., Lundh, J. S., Huang, H. L., Zheng, Y., Zhang, Y., Park, M., Mirabito, T., Beaucejour, R., Chae, C., McIlwaine, N., Esteves, G., Beechem, T. E., Moe, C., Dargis, R., Jones, J., Leach, J. H., Lavelle, R. M., Snyder, D. W. & Maria, J. P. & 8 others, , Nov 7 2022, In: Journal of Applied Physics. 132, 17, 175108.Research output: Contribution to journal › Article › peer-review