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Recent Publications
Transient Thermal Management of a β-GaO MOSFET Using a Double-Side Diamond Cooling Approach
Kim, S. H., Shoemaker, D., Green, A. J., Chabak, K. D., Liddy, K. J., Graham, S. & Choi, S., Apr 1 2023, In: IEEE Transactions on Electron Devices. 70, 4, p. 1628-1635 8 p.Research output: Contribution to journal ⺠Article ⺠peer-review
Ultra-Wide Band Gap Ga2O3-on-SiC MOSFETs
Song, Y., Bhattacharyya, A., Karim, A., Shoemaker, D., Huang, H. L., Roy, S., McGray, C., Leach, J. H., Hwang, J., Krishnamoorthy, S. & Choi, S., Feb 8 2023, In: ACS Applied Materials and Interfaces. 15, 5, p. 7137-7147 11 p.Research output: Contribution to journal ⺠Article ⺠peer-review
β-Gallium oxide power electronics
Green, A. J., Speck, J., Xing, G., Moens, P., Allerstam, F., Gumaelius, K., Neyer, T., Arias-Purdue, A., Mehrotra, V., Kuramata, A., Sasaki, K., Watanabe, S., Koshi, K., Blevins, J., Bierwagen, O., Krishnamoorthy, S., Leedy, K., Arehart, A. R., Neal, A. T., Mou, S., & 14 others, Feb 1 2022, In: APL Materials. 10, 2, 029201.Research output: Contribution to journal ⺠Article ⺠peer-review
ASME 2022 INTERNATIONAL TECHNICAL CONFERENCE and EXHIBITION on PACKAGING and INTEGRATION of ELECTRONIC and PHOTONIC MICROSYSTEMS
Gromala, P., Prakash, A., Choi, S., Agonafer, D., Won, Y. & Karajgikar, S., 2022, In: Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2022. v001t00a001.Research output: Contribution to journal ⺠Editorial ⺠peer-review
Thermally-Aware Layout Design of β-GaO Lateral MOSFETs
Kim, S. H., Shoemaker, D., Chatterjee, B., Green, A. J., Chabak, K. D., Heller, E. R., Liddy, K. J., Jessen, G. H., Graham, S. & Choi, S., Mar 1 2022, In: IEEE Transactions on Electron Devices. 69, 3, p. 1251-1257 7 p.Research output: Contribution to journal ⺠Article ⺠peer-review
All-around diamond for cooling power devices
Ryou, J. H. & Choi, S., Dec 2022, In: Nature Electronics. 5, 12, p. 834-835 2 p.Research output: Contribution to journal ⺠Article ⺠peer-review
Growth-microstructure-thermal property relations in AlN thin films
Song, Y., Zhang, C., Lundh, J. S., Huang, H. L., Zheng, Y., Zhang, Y., Park, M., Mirabito, T., Beaucejour, R., Chae, C., McIlwaine, N., Esteves, G., Beechem, T. E., Moe, C., Dargis, R., Jones, J., Leach, J. H., Lavelle, R. M., Snyder, D. W., Maria, J. P., & 8 others, Nov 7 2022, In: Journal of Applied Physics. 132, 17, 175108.Research output: Contribution to journal ⺠Article ⺠peer-review
Special Issue on InterPACK2020
Yang, J., Choi, S., Lee, J. & Karajgikar, S., Jun 2022, In: Journal of Electronic Packaging, Transactions of the ASME. 144, 2, 020301.Research output: Contribution to journal ⺠Editorial ⺠peer-review
130 mA mm-1β-Ga2O3metal semiconductor field effect transistor with low-temperature metalorganic vapor phase epitaxy-regrown ohmic contacts
Bhattacharyya, A., Roy, S., Ranga, P., Shoemaker, D., Song, Y., Lundh, J. S., Choi, S. & Krishnamoorthy, S., Jul 2021, In: Applied Physics Express. 14, 7, 076502.Research output: Contribution to journal ⺠Article ⺠peer-review
Electro-Thermal Investigation of GaN Vertical Trench MOSFETs
Chatterjee, B., Ji, D., Agarwal, A., Chan, S. H., Chowdhury, S. & Choi, S., May 2021, In: IEEE Electron Device Letters. 42, 5, p. 723-726 4 p., 9374955.Research output: Contribution to journal ⺠Article ⺠peer-review
Thermal design of multi-fin Ga2O3 vertical transistors
Chatterjee, B., Li, W., Nomoto, K., Xing, H. G. & Choi, S., Sep 6 2021, In: Applied Physics Letters. 119, 10, 103502.Research output: Contribution to journal ⺠Article ⺠peer-review
A perspective on the electro-thermal co-design of ultra-wide bandgap lateral devices
Choi, S., Graham, S., Chowdhury, S., Heller, E. R., Tadjer, M. J., Moreno, G. & Narumanchi, S., Oct 25 2021, In: Applied Physics Letters. 119, 17, 170501.Research output: Contribution to journal ⺠Review article ⺠peer-review
2021 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems (InterPACK)
Dogruoz, B., Lall, P., Gromala, P., Choi, S. & Agonafer, D., 2021, In: Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2021. v001t00a001.Research output: Contribution to journal ⺠Editorial ⺠peer-review
Integrating boron arsenide into power devices
Graham, S. & Choi, S., Jun 2021, In: Nature Electronics. 4, 6, p. 380-381 2 p.Research output: Contribution to journal ⺠Comment/debate ⺠peer-review
Thermal conductivity of plasma-enhanced atomic layer deposited hafnium zirconium oxide dielectric thin films
Kim, J., Lee, S., Song, Y., Choi, S., An, J. & Cho, J., Jun 2021, In: Journal of the European Ceramic Society. 41, 6, p. 3397-3403 7 p.Research output: Contribution to journal ⺠Article ⺠peer-review