3D Imaging Capabilities at Penn State

Date and Time
Wed, Mar 3 2021, 12pm
In this webinar, the presenters will highlight Penn State’s 3D imaging capabilities. Presenters will showcase three complementary analytical technologies: Industrial Micro/Nano X-ray CT Focused Ion Beam (FIB) Transmission Electron Microscopy (TEM) A multimodal/multiscale approach will be introduced to demonstrate the benefits of pairing independently sourced datasets that are then overlayed into a 3D map detailing sample attributes for a more complete inspection.  This approach utilizes X-ray CT to provide bulk 3D data, allowing the investigator(s) to target regions of interest within the sample at higher resolutions using FIB, TEM or further X-ray CT. These imaging techniques work together to optimize data collection within each sample’s region(s) of interest, providing more detailed insight to the characterization and distribution of material properties. We will discuss and provide material examples, including carbon composite, cortical bone, and electrical components. These examples will illustrate the benefits of this multimodal/multiscale approach to provide for a more thorough, measurable inspection of samples via spatially referenced data.  Center for Quantitative Imaging Lab is equipped with industrial micro/nano The lab is equipped with industrial micro/nano X-ray CT scanners, which include: GE v|tome|x L300 scanner with dual X-ray sources, walk-in cabinet and adaptable axes motions, allowing for imaging samples ranging from 500 mm to less than 1mm in diameter with resolutions approaching the nm scale. Zeiss Versa 620, a true nano-scale imaging system.  The Versa, as configured, is optimally designed to image small samples, ranging from 10 mm to fractions of a mm in diameter, with resolutions near 100 nm or less.  The Materials Charterzation Laboratory currently maintains a suite of (9) advanced electron microscopes which includes (2) dual-beam FIBs, (3) SEMs, and (4) TEMs.  These microscopes are equipped with a wide range of spectroscopic capabilities (EDS, EELS, EFTEM), high resolution imaging (aberration corrected, field emission), and advance in situ functionality which enables samples to be imaged under:  elevated + cryogenic temperatures, mechanical stress, liquid environments, and electrical biasing. Presenters: Tim Stecko, EESL Center for Quantitative Imaging Laboratory Dr. Trevor Clark, Materials Characterization Laboratory Dr. Jennifer Gray, Materials Characterization Laboratory